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Changchun New Industries Optoelectronics Technology Co., Ltd.
With the development of semiconductor chip technology and optical technology, the output power of semiconductor laser is constantly improved, the beam quality is obviously improved, and more applications are obtained in the industrial field. At present, the output power and beam quality of industrial high-power semiconductor laser have exceeded the lamp pumped YAG laser, and have approached the semiconductor pumped YAG laser. Semiconductor lasers have been gradually used in plastic welding, cladding and alloying, surface heat treatment, metal welding and other aspects, and also in marking, cutting and other aspects have made some progress.
1) laser plastic welding
The beam of semiconductor laser is flat-topped beam, and the spatial distribution of cross section intensity is uniform. Compared with the beam of YAG laser, the beam of semiconductor laser can obtain better weld consistency and welding quality in the application of plastic welding, and can carry out wide seam welding. Plastic welding application of the semiconductor laser power requirements are not high, generally 50 ~ 700W, beam quality less than 100mm/mrad, spot size of 0.5 ~ 5mm. Welding with this technology will not damage the workpiece surface, local heating reduces the thermal stress on the plastic parts, can avoid damaging the embedded electronic components, also better avoid plastic melting. By optimizing the raw materials and pigments, laser plastic welding can obtain different synthetic colors. At present, semiconductor lasers have been widely used in welding sealed containers, electronic component shells, automotive parts and heterogeneous plastic components.
(2) laser cladding and surface heat treatment
It is an important application of semiconductor laser in machining to conduct surface heat treatment or partial cladding on metal parts with high wear resistance and corrosion resistance. Internationally, the power of semiconductor lasers used for laser cladding and surface heat treatment is 1 ~ 6kW, the beam quality is 100 ~ 400mm/mrad, and the spot size is 2 2mm2 ~ 3 3mm2 or 1 5mm2. Compared with other lasers, the advantages of using semiconductor laser beam for cladding and surface heat treatment are high electro-optical efficiency, high material absorption, low maintenance cost, rectangular spot shape, uniform light intensity distribution and so on. At present, semiconductor laser cladding and surface heat treatment have been widely used in power, petrochemical, metallurgy, steel, machinery and other industrial fields, becoming one of the important means of new material preparation, rapid and direct manufacturing of metal parts, and green remanufacturing of failed metal parts.
(3) laser metal welding
High-power semiconductor lasers have many applications in metal welding, ranging from precision spot welding of automobile industry to heat conduction welding of production materials and axial welding of pipelines, with good welding quality and no need for post-processing. The semiconductor laser used for thin metal welding requires its power of 300 ~ 3000W, beam quality of 40 ~ 150mm/mrad, spot size of 0.4 ~ 1.5mm, welding material thickness of 0.1 ~ 2.5mm. Because of the low heat input, the distortion of the parts is kept to a minimum. High power semiconductor laser can be used for high speed welding, the welding seam is smooth and beautiful, it has special advantages in welding process and labor saving before and after welding, it is very suitable for different needs of industrial welding, it will gradually replace the traditional welding method.
(4) laser marking
Laser marking technology is one of the biggest application fields of laser machining. The lasers currently in use are YAG, CO2 and semiconductor pumped lasers. But with the improvement of laser beam quality semiconductor laser marking machine has begun to be used in the marking field. LIMO has launched a 5mm/mrad 50W direct output semiconductor laser and a 50 m fiber-coupled 25W semiconductor laser, which meet the requirements for laser output power and beam quality for marking applications.
(5) laser cutting
The application of high power semiconductor laser in cutting field started late. Supported by the "modular semiconductor laser system" (MDS) program of the German ministry of education and research, fraunhofer institute developed a 800W semiconductor laser cutting machine in 2001, which can cut 10mm thick steel plates at a cutting speed of 0.4m/min.
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